AFV-1 device for semiconductor package substrates
High resolution, low resolution, and various inspections! Options for single-sided/double-sided and color/monochrome available!
The "AFV-1 device for semiconductor package substrates" is a device capable of high-resolution, low-resolution, and various inspections. By utilizing CAM, it generates Auto References. In addition to single-sided/double-sided inspections, you can choose between color and monochrome. 【Features】 ■ Capable of inspecting high-resolution, low-resolution, and various products ■ Monochrome and color inspections available ■ Double-sided and single-sided inspections available ■ Generates Auto References using CAM *For more details, please refer to the PDF document or feel free to contact us.
- Company：ラットコーポレーション 本社：営業部・業務部
- Price：Other
